Single Point Small Wave Soldering Nozzle White Selective Soldering
Machine
Application: welding PCB components
Product Parameters
| Entry Name | Technical Parameters |
| Machine model | CWLS-S |
| Total power | 5KW |
| Power | Single Phase 220V 50HZ |
| Tin Tank Capacity | 15kgs/furnace |
| Melting Time | 20-30 Minutes |
| Tin Groove Power | 1.2KW |
| Small Wave Soldering Nozzle | Custom Shape |
| Size | L850*W1100*H1340mm |
| Weight | 200KG |
Where conventional soldering techniques reach their limits
Laser soldering is often applied as selective laser soldering.
Selective soldering processes are used in applications where other
conventional selective soldering techniques reach their limits.
These limits can be for example defined by temperature-sensitive
components. The transfer of heat and energy through the laser beam
provides the user with many advantages, especially with view to the
miniaturization of sub-assemblies or sensitive components.
During the soldering process, the filler metal or alloy is heated
to melting temperatures < 450°C by laser. Therefore lasers with
lower output powers (typically < 100 Watts) are used to melt the
wire material, soldering paste or solder deposits so that it flows
in between the two closely fitted joining materials.
For soldering small parts or components within the semiconductor,
electronic or opto-electronic device manufacturing or assemblies
industry, the diode laser is the right choice. Diode lasers are
used for selective soldering because the laser power can be
precisely controlled by an analog signal and the heat input into
the material is very localized. That is why laser soldering is most
advantageous, compared to traditional soldering methods. The
process does not damage or input heat into nearby components. That
is why even very small electronic components, in the range of a few
tenths of a millimeter, as well as heat sensitive electronic parts
can be processed.
Fast power controllability combined with a non-contact temperature
measurement to minimize thermal damage make the diode laser an
ideal tool for this application.
Conventional selective soldering techniques, such as e.g. the
soldering iron, need a direct mechanical contact between the
soldering tool and the solder joint, or the soldering tool has to
be very close to the solder joint. Yet, in many cases, this is not
possible due to a lack of space. Furthermore, within conventional
selective soldering processes, the energy input is either not or is
very slowly able to be influenced during the soldering process.
